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| Continued Growth Technology Roadmap |
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| As semiconductor wafer fabrication continues to shift to Asia, ISP is strategically located to service & support our customers. ISP plans to expand its current facilities in Singapore in 2004 and set up a second plant in late 2004 in another Asia wafer fab hub to be even closer to customers. |
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| In order to support our customers? technology roadmap, ISP will invest aggressively over the next few years in process knowledge, research & development and state-of-the-art equipment to achieve the higher specifications demanded by customers. ISP technology roadmap is outlined: |
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| In addition, ISP plans to start providing wafer reclaim services for 300mm wafers in 2005. ISP management team and staff are dedicated towards attainting our vision of being a premier international semiconductor services company with global network to provide our customers with uncompromised high quality services anytime, anywhere. |
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